Lead Frame

Product Name: Lead Frame

Material: Copper Alloy C7025

Dimensions: 120*120*12 mm

Processing Method: 5-Axis CNC Machining

Product Features:

As a critical component in semiconductor packaging, lead frames demand extremely stringent requirements for geometric tolerances, surface finish, and micro-structure consistency. Our 5-axis CNC machining technology enables integrated manufacturing of complex profiles, micron-level precision slots/holes, and ultra-thin wall structures.

By employing dynamic tool-axis control and intelligent compensation algorithms, we overcome the challenges posed by the copper alloy's high hardness and susceptibility to deformation, achieving dimensional accuracy within ±0.005mm and superior surface quality (Ra 0.1μm).

Through multi-process integration optimization, we significantly enhance production efficiency while eliminating repositioning errors. This ensures reliable high-frequency signal transmission and long-term durability for semiconductor devices, providing a robust technical foundation for precision packaging solutions.